B82498F3270J TDK

B82498F3270J Images

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Part Number B82498F3270J
Manufacturer TDK
Quantity in stock 308540 Pieces
Market Price -
Our Better Price Send by email: [email protected]
Delivery Time 1 day (can ship today)
Description Ind Chip Molded Wirewound 27nH 5% 250MHz 60Q-Factor Ceramic 700mA 0805 Blister T R
Category Inductor
Family Inductor Surface Mount
ROHS Compliant Yes
MSL Level B82498F3270J
Datasheet download B82498F3270J.pdf
Request Quotation for B82498F3270J

B82498F3270J Specifications

Part Number B82498F3270J
Protection Style Molded
Test Frequency 250 MHz
Lead Finish Silver/Palladium/Platinum
MSL Level 1
Core Material Ceramic
Technology Wirewound
Product Dimensions 2.3 x 1.7 x 1.4 mm
Rad Hard No
Package/Case 0805
Max Processing Temp 260
Tolerance 5 %
Type Chip
Product Depth 1.7 mm
Product Height 1.4 mm
Product Length 2.3 mm
Replacement Part Number PART-B82498F3270J
Weight Contact us
Country of Origin -

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